The strong point for CSP(chip size package) resonator (HDR330M-B13).
1. Adopting the most advanced flip chip technology, flipping the chip on the package after bump bonding , then using the ultrasonic technology to connect the input and output pin.
This process can greatly reduce the fault rate caused by circuit-short or circuit-break.
2. Chip-size package-- SMD 2.0*1.6mm.
They can meet the needs of miniaturized products.
3. Competitive price.
As real SMD-type resonator , their price is only half of similar SMD3030 or SMD 5035 series ,
They can be used as a low-cost solution for the users, while greatly reduce the labor costs of traditional DIP series.
4. Large manufacturing capacity and Short Lead Time .
Our lead time for CSP resonator is only one week, because they are produced by fully automatic equipment.
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